Bonding in Microsystem Technology [electronic resource] / by Jan A. Dziuban.
Material type:
Computer fileSeries: Springer Series in Advanced Microelectronics ; 24Publication details: Dordrecht : Springer, 2006.Edition: 1a edDescription: v.: digitalISBN: - 9781402045899
- TK7874
| Item type | Current library | Call number | URL | Copy number | Status | Notes | Barcode | |
|---|---|---|---|---|---|---|---|---|
Libro Electrónico
|
Biblioteca Digital Colección Digital | TK7874 D95 2006 (Browse shelf(Opens below)) | Link to resource | 1 | Available | SpringerLink | BDIG00003932 |
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