TY  - DATA
AU  - Dziuban,Jan A.
ED  - SpringerLink (Online service)
TI  - Bonding in Microsystem Technology
T2  - Springer Series in Advanced Microelectronics,
SN  - 9781402045899
AV  - TK7874 
PY  - 2006///
CY  - Dordrecht
PB  - Springer
KW  - Microtecnología
KW  - Sistemas microelectromecánicos
UR  - http://dx.doi.org/10.1007/1-4020-4589-1
ER  -