| 000 | 01218nmm a22003615u 4500 | ||
|---|---|---|---|
| 999 |
_c17781 _d17781 |
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| 005 | 20200704095311.0 | ||
| 008 | 100301s2006 xx j eng d | ||
| 020 | _a9781402045899 | ||
| 050 | 0 | 4 | _aTK7874 |
| 100 | 1 | _aDziuban, Jan A. | |
| 245 | 1 | 0 |
_aBonding in Microsystem Technology _h[electronic resource] / _cby Jan A. Dziuban. |
| 250 | _a1a ed. | ||
| 260 |
_aDordrecht : _bSpringer, _c2006. |
||
| 300 | _bv.: digital | ||
| 490 | 0 |
_aSpringer Series in Advanced Microelectronics, _v24 _x1437-0387 ; |
|
| 650 | 0 | _aMicrotecnología | |
| 650 | 4 | _aSistemas microelectromecánicos | |
| 710 | 2 | _aSpringerLink (Online service) | |
| 773 | 0 | _tSpringer eBooks | |
| 856 | 4 | 0 | _uhttp://dx.doi.org/10.1007/1-4020-4589-1 |
| 942 |
_2lcc _cLIE |
||