Integrated Circuit Packaging, Assembly and Interconnections [electronic resource] / by William J. Greig.

By: Contributor(s): Material type: Computer fileComputer filePublication details: Boston, MA : Springer Science+Business Media LLC, 2007.Description: v.: digitalISBN:
  • 9780387339139
Subject(s): LOC classification:
  • TK7874  G74 2007
Online resources: In: Springer eBooks
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Holdings
Item type Current library Call number URL Copy number Status Notes Barcode
Libro Electrónico Libro Electrónico Biblioteca Digital Colección Digital TK7874 G74 2007 (Browse shelf(Opens below)) Link to resource C : 1 Available SpringerLink BDIG00010461

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