Greig, William J. <br/><br/>
Integrated Circuit Packaging, Assembly and Interconnections  [electronic resource] / 
by William J. Greig. 
 - Boston, MA :  Springer Science+Business Media LLC,  2007. 
 -  v.: digital 
<br/><br/><label>ISBN: </label>9780387339139 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Engineering<br/>Engineering design<br/>Electronics<br/>Systems engineering<br/>Optical materials<br/>Engineering<br/>Electronics and Microelectronics, Instrumentation<br/>Circuits and Systems<br/>Engineering Design<br/>Optical and Electronic Materials
<br/><br/><label>LC Class. No.: </label>TK7874   / G74 2007