TY  - DATA
AU  - Greig,William J.
ED  - SpringerLink (Online service)
TI  - Integrated Circuit Packaging, Assembly and Interconnections
SN  - 9780387339139
AV  - TK7874  G74 2007
PY  - 2007///
CY  - Boston, MA
PB  - Springer Science+Business Media LLC
KW  - Engineering
KW  - Engineering design
KW  - Electronics
KW  - Systems engineering
KW  - Optical materials
KW  - Electronics and Microelectronics, Instrumentation
KW  - Circuits and Systems
KW  - Engineering Design
KW  - Optical and Electronic Materials
UR  - http://dx.doi.org/10.1007/0-387-33913-2  
ER  -