Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging [electronic resource] / edited by E. Suhir, Y. C. Lee, C. P. Wong.
Material type:![Computer file](/opac-tmpl/lib/famfamfam/CF.png)
- 9780387329895
- Engineering
- Particles (Nuclear physics)
- Engineering design
- System safety
- Electronics
- Optical materials
- Surfaces (Physics)
- Engineering
- Electronics and Microelectronics, Instrumentation
- Optical and Electronic Materials
- Engineering Design
- Solid State Physics and Spectroscopy
- Surfaces and Interfaces, Thin Films
- Quality Control, Reliability, Safety and Risk
- TK7874 S84 2007
Item type | Current library | Call number | URL | Copy number | Status | Notes | Date due | Barcode | |
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Biblioteca Digital Colección Digital | TK7874 S84 2007 (Browse shelf(Opens below)) | Link to resource | 1 | Available | Springerlink | BDIG00010913 |
Browsing Biblioteca Digital shelves, Shelving location: Colección Digital Close shelf browser (Hides shelf browser)
TK7874 S39 2005 Force Sensors for Microelectronic Packaging Applications | TK7874 S54 2006 Multiscaling in Molecular and Continuum Mechanics: Interaction of Time and Size from Macro to Nano | TK7874 S74 2006 Analog Circuit Design | TK7874 S84 2007 Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging | TK7874 T36 2008 Wafer Level 3-D ICs Process Technology | TK7874 T44 2008 Nanometer Technology Designs High-Quality Delay Tests | TK7874 V36 2005 Systematic Modeling and Analysis of Telecom Frontends and Their Building Blocks |
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