Bonding in Microsystem Technology [electronic resource] / by Jan A. Dziuban.
Material type:![Computer file](/opac-tmpl/lib/famfamfam/CF.png)
- 9781402045899
- TK7874
Item type | Current library | Call number | URL | Copy number | Status | Notes | Date due | Barcode | |
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Biblioteca Digital Colección Digital | TK7874 D95 2006 (Browse shelf(Opens below)) | Link to resource | 1 | Available | SpringerLink | BDIG00003932 |
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