Bonding in Microsystem Technology [electronic resource] / by Jan A. Dziuban.

By: Contributor(s): Material type: Computer fileComputer fileSeries: Springer Series in Advanced Microelectronics ; 24Publication details: Dordrecht : Springer, 2006.Edition: 1a edDescription: v.: digitalISBN:
  • 9781402045899
Subject(s): LOC classification:
  • TK7874
Online resources: In: Springer eBooks
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Holdings
Item type Current library Call number URL Copy number Status Notes Date due Barcode
Libro Electrónico Libro Electrónico Biblioteca Digital Colección Digital TK7874 D95 2006 (Browse shelf(Opens below)) Link to resource 1 Available SpringerLink BDIG00003932

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