TY  - DATA
AU  - Tan,Chuan Seng
AU  - Gutmann,Ronald J.
AU  - Reif,L.Rafael
ED  - SpringerLink (Online service)
TI  - Wafer Level 3-D ICs Process Technology
T2  - Integrated Circuits and Systems,
SN  - 9780387765341
AV  - TK7874 T36 2008
PY  - 2008///
CY  - Boston, MA
PB  - Springer-Verlag US
KW  - Engineering
KW  - Electronics
KW  - Optical materials
KW  - Surfaces (Physics)
KW  - Electronics and Microelectronics, Instrumentation
KW  - Optical and Electronic Materials
KW  - Surfaces and Interfaces, Thin Films
KW  - Engineering, general
UR  - http://dx.doi.org/10.1007/978-0-387-76534-1
ER  -