Integrated Circuit Packaging, Assembly and Interconnections [electronic resource] / by William J. Greig.

By: Contributor(s): Material type: Computer fileComputer filePublication details: Boston, MA : Springer Science+Business Media LLC, 2007.Description: v.: digitalISBN:
  • 9780387339139
Subject(s): LOC classification:
  • TK7874  G74 2007
Online resources: In: Springer eBooks
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Holdings
Item type Current library Call number URL Copy number Status Notes Date due Barcode
Libro Electrónico Libro Electrónico Biblioteca Digital Colección Digital TK7874 G74 2007 (Browse shelf(Opens below)) Link to resource C : 1 Available SpringerLink BDIG00010461

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